According to a recent report by QYResearch, the global semiconductor sealing market is experiencing rapid expansion, reaching a market size of 27.48 billion yuan in 2024 and projected to exceed 43.56 billion yuan by 2031, with a compound annual growth rate of 6.8%. This growth is mainly driven by three factors:
First, the accelerated iteration of advanced manufacturing processes, with 3-nanometer and below processes placing higher demands on the high-temperature resistance and plasma erosion resistance of seals, has led to a surge in demand for high-end materials such as perfluoroether rubber (FFKM).
Secondly, the trend of supply chain localization is driving countries to increase investment in the research and development and production of domestic sealing components in order to reduce their dependence on imports.
The above process is to molding the silicone directly on the fabric or garment. In this way, you should have very proven technique, make sure the fabric high temperature resistance and will not hurt the fabric or make the fabric dirty after heat press molding silicone
With the popularization of technologies such as 5G, AI, and autonomous driving, the semiconductor industry will continue to expand. As a core consumable, sealing components have broad market prospects and have become a new investment hotspot in the industrial sector.