In semiconductor manufacturing, processes such as dry etching and chemical vapor deposition (CVD) need to operate in environments with high temperatures of 300°C, strong plasma, and corrosive chemical media. Traditional seals often leak due to material aging and stress concentration, affecting wafer yield.
Recently, domestically produced perfluoroelastomer (FFKM) inflatable seals have achieved a technological breakthrough. Their gradient braided structure effectively disperses stress concentration under high temperature and pressure, and combined with a dynamic vulcanization process, forms an interpenetrating network, enhancing fatigue resistance. Third-party verification shows that these seals maintain zero leakage even after millions of cycles at 300℃, exhibit 50% improved resistance to plasma erosion, and have a lifespan three times longer than traditional products
This breakthrough supports the stability of advanced processes at 3 nanometers and below, reduces the frequency of equipment downtime and maintenance, promotes the self-reliance and controllability of the semiconductor industry chain, and becomes a key upgrade for the “safety belt” of high-end equipment
